| 摘要 |
A solid-state image sensing element is disposed below and tightly enclosed with an optically transparent cover in order to protect the element from the outside, the cover being integrally formed into an inverse U-shape in a cross-section. The cover is made of plastics having good light transmissivity. The solid-state image sensing element is mounted on a substrate and is electrically connected thereto through metal wires. The above-mentioned transparent cover is adhered on the substrate through an adhesive such as an epoxy resin or the like so that the element is tightly enclosed. Thus, there is provided a solid-state image sensing device which is light in weight and can be fabricated at a low cost.
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