| 摘要 |
PURPOSE:To keep the high degree of thickness uniformity and the flatness of a wafer so as to enable mirror-face like polishing to be carried out nicely by providing a support member for a holding plate, a ring-like elastic member, a plate-like elastic member, a closed space of a recess part and a supply means for supplying a fluid of designated pressure to the closed space. CONSTITUTION:A polishing device comprises a recess part 26 opened downward, a support member 24 for supporting a holding plate 10 not to fall down in the recess part 26, and a ring-like elastic member 34 disposed between the outer peripheral surface of the holding plate 10 and the inner peripheral surface of the recess part 26 for permitting the horizontal movement of the holding plate 10 within a very small range. The holding plate 10 is adapted to be movable within a very small range in the vertical direction and in the horizontal direction and fixed extending between the inner peripheral surface of the recess part 26 and the holding plate 10. The plate is suspended by the plate-like elastic member 38, the closed space 50 in the recess part 26 is partitioned by the plate- like elastic member 38m and a fluid with designated pressure is supplied to the closed space 50 by a supply means. Accordingly, the isobaric load can be applied to the whole surface of a wafer. |
