Platinum electroforming and platinum electroplating

摘要

The invention relates to platinum electroforming and platinum electroplating capable of preparing a deposited platinum material having high hardness and increased thickness and size. The platinum electroforming or electroplating bath comprises at least one compound selected from the group consisting of chloroplatinic acid, chloroplatinates of alkali metals, hydrogen hexahydroxoplatinate, and hexahydroxoplatinates of alkali metals, 2-100 g/l as platinum and a hydroxylated alkali metal, 20-100 g/l.