| 摘要 |
A heat-resistant and high-transparence polyesterimide composition is disclosed which is prepared from the reaction of: (a) an imidihydroxycarboxylic acid represented by the following formula: <IMAGE> (b) at least one dicarboxylic, such as terephthalic acid or isophthalic acid, or mixture thereof, and (c) at least one dihydroxy compound represented by the following formula: <IMAGE> Wherein Y can be -C(CH3)2-, -SO2-, -CH(CH3)-, -(CH2)m-, where m in an integer of 1 to 10, -O-, or -S-; X can be H, Cl, or Br; and n is an integer of 0 to 4. The polyesterimide resins disclosed in this invention also exhibit improved fabricability due to their improved solubility in organic solvents, and improved mechanical strength.
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