| 摘要 |
PURPOSE:To provide a method for manufacturing caramic substrates which are excellent in adhesion strength and junction stability between a ceramic substrate and an external layer circuit and generate no cracks in an external layer circuit. CONSTITUTION:Unsintered sheets 61, 69 which are not sintered at a sinter temperature of a green sheet are mounted on the top and the bottom of green sheets 71-79 used to form a ceramic substrate and press-bonded to obtain a press-bonded body 81. Next, the press-bonded body 81 is baked at a sinter temperature of a green sheet to obtain a baked body. And, the unsintered sheets 61,69 are peeled off from the baked body. Then, remaining particles of the unsintered sheets 61, 69 are removed by polishing the surface of the ceramic substrate. An external layer circuit is formed on the surface of the ceramic substrate. Polishing can be conducted by a lap, barrel, puff, sandblast, sander belt, hydrofluoric acid, etc. |
