| 摘要 |
PURPOSE:To obtain a resin seal equipment which can realize, with high reproducibility, a resin seal semiconductor element having a specified shape, without depending the amount of injection resin. CONSTITUTION:A semiconductor element, a lead frame, and resin 14 are set between a sealing top force 12 and a sealing lower force 13. Resin sealing is executed by applying pressure to the resin via plungers 1 inserted into a cavity part of the sealing lower force. At this time, a plurality of the plungers are dipped in an oil pressure tank 2, and uniform pressure is applied to each plunger when a pressure is applied from the outside. As the result, a resin seal semiconductor element having a stable shape can be obtained. |
