| 摘要 |
PURPOSE:To obtain a high reliability surface mount circuit device of high density wherein outer leads of a TAB package of multipin and narrow pitch can be surely electrically mechanically connected with specified connection pad surfaces, and a mounting method which can constitute the high reliability surface mount circuit device. CONSTITUTION:The title device consists of the following; a circuit board 7 on the main surface of which rows of connection pads 8 are arranged, a TAB package 6 wherein outer leads 6a are positioned and arranged so as to face the connection pads 8, and a photo-setting type resin part 9 which electrically connects connection pads 8 and the outer leads 6a which correspond with each other by compression bonding of cure shrinkage action. |
