| 摘要 |
<p>PURPOSE:To increase the number of chips obtained from a wafer, by arranging the crystal orientation of a wafer in a constat direction so as to correspond with the crystal orientation of a wafer to be measured, and forming a positioning mark at a specified part of the wafer. CONSTITUTION:An X-ray entering an X-ray counting part 5 is monitored by a count recording part 11 connected with the X-ray counting part 5. When diffracted X-rays enter the X-ray counting part 5, a signal is transmitted to a positioning control part 12 and a position control part 13 from the count recording part 11. By the position control part 13, a motor 9 is interrupted, and the rotaion of a wafer 6 is interrupted. The crystal orientation of the wafer 6 is arranged in a specified direction. From a positioning mark forming equipment 3 which is arranged at a specified position by a positioning control part 12, with respect to the X-ray counting part 5 or an X-ray radiation source 4, a positioning mark is formed on the surface or the rear of the wafer 6.</p> |
