DRY ETCHING DEVICE

摘要

PURPOSE:To maintain a wafer temperature as desired or control it at an arbitrary value. CONSTITUTION:A temperature detection part 18 for detecting a wafer temperature and a pressure detection part 16 for detecting a pressure of cooling gas are provided to a substrate stage 2 whereon a semiconductor wafer 3 is mounted. A wafer temperature and a cooling gas pressure during etching treatment are monitored and change thereof is output to a pressure control device 15 of cooling gas through a control part 22. A wafer temperature is maintained as desired or controlled at an arbitrary value in this way.