RESIN SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a thin semiconductor device which has excellent resistance against the reflow of solder. CONSTITUTION:Slopes are formed on inner edges of a frame tub 2 supporting a semiconductor element 1 that has corresponding slant sides on which it is bonded to the tub 2 with a bonding agent 6. Since side faces of the element 1 are supported on the slopes of the tub 2, the element 1 can be easily mounted on the tub 2 in a highly stable state. Therefore, the problem encountered when the element is mounted by the conventional technique can be solved.