| 摘要 |
<p>PURPOSE:To provide a solder resist ink developing no curl phenomenon, excellent in flexibility, heat resistance and adhesiveness, suitable for e.g. the cover coating for printed circuit boards, comprising polyparabanic acid, phenoxy resin and amino group-bearing butadiene-acrylonitrile copolymer rubber. CONSTITUTION:This solder resist ink essentially comprises (A) 100 pts.wt. of polyparabanic acid, (B) pref. 50-100 pts.wt. of a phenoxy resin, and (C) pref. 50-100 pts.wt. of an amino group-bearing butadiene-acrylonitrile copolymer rubber.</p> |
