| 摘要 |
In a method of molding a tag pin assembly P having a plurality of tag pins p each comprising a head 1, a filament portion 2 and a transverse rod portion 3, and implanted on one connecting rod 5 via connecting portions 4, the present invention produces a tag pin assembly under a ultra-close contact state by allowing balanced pressures to act on thin wall surfaces between adjacent cavities by supplying a molten resin through a main runner portion 30 connected to an injection molding machine, one first sub-runner portion 31 and a U-shape branched second sub-runner portion 32 to cavities of four tag pins 4 for one second sub-runner portion 32 in a cascade system by halving the molten resin.
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