Vorrichtung und Verfahren zur Ermittlung fehlenden Verbindungsmaterials
摘要
Apparatus and method for detecting missing interconnect material. The distance traveled by a bonding tool is measured while the interconnect material is being bonded to a site. Unless it exceeds a predetermined threshold, a signal is generated indicating missing interconnect material. A pivoting system associated mating electrical contacts, and a measurement/comparator are advantageously employed to facilitate this measurement.
申请公布号
DE4222579(C2)
申请公布日期
1994.05.05
申请号
DE19924222579
申请日期
1992.07.09
申请人
HUGHES AIRCRAFT CO., LOS ANGELES, CALIF., US
发明人
GABALDON, JOHN B., SAN DIEGO, CALIF., US;EVANS JUN., DANIEL D., OCEANSIDE, CALIF., US;CAWELTI, DALE W., CARLSBAD, CALIF., US