| 摘要 |
Provided is a method and apparatus for electrically detecting the location of bond failure and wire breakage occurring during tensile strength testing of a wire sample (14) having first and second bond foots (16,18) affixed to respective first and second support pads (20,22). The method and apparatus monitors the voltage levels of first and second electrically conductive probes (28,34). The first probe (28) has a primary lead (24) in electrical contact with the first support pad (20) and a secondary lead (26) in electrical contact with the first bond foot (16). Similarly, the second electrically conductive probe (34) has a primary lead (30) in electrical contact with the second support pad (22) and a secondary lead (32) in electrical contact with the second bond foot (18). Voltage detection means is provided in electrical contact with the first and second probes (28,34) for detecting the voltage level at each of the respective (58,60,62,64) primary and secondary leads to generate the respective corresponding output signals. Comparator means is further provided in electrical contact with the voltage detection means for receiving and comparing each of the output signals to a selected reference value and generating a supplemental output signal indicating the location of bond failure or wire breakage. |
