| 摘要 |
<p>An adhesive composition containing a latex binder, a latex plasticizer and a functional filler. The latex plasticizer includes a copolymer comprising (1) 0-15% by weight, based upon the weight of the copolymer, of acrylonitrile, methacrylonitrile or mixtures thereof, (ii) 80-85% by weight, based upon the weight of the copolymer, of butyl acrylate, ethyl acrylate, 2-ethylhexyl acrylate, lauryl acrylate, lauryl methacrylate, octyl acrylate, heptyl acrylate, or mixtures thereof, and (iii) 1-5% by weight, based upon the weight of the copolymer, of methacrylic acid, acrylic acid, itaconic acid, or mixtures thereof, said latex plasticizer having a Tg less than that of the latex binder (a) and a decomposition temperature of at least 288 DEG C. The composition is useful for adhering polyimide films such as in the fabrication of flexible circuits.</p> |
