| 摘要 |
An electronic device packaging structure is described which contains a lead frame (32) on which the electronic device (30) is disposed. The electronic device has contact locations (4,44) at one edge thereof. The lead frame has leads (36) which extend under the electronic device and inwardly from the opposite direction. Wires (14,42) are wire bonded between electronic device contact locations (4,44) and the beam leads (12,40) which extend under the electronic device and the ends of the leads which extend inwardly from the opposite direction. Two electronic devices (70,72) are stacked in at an offset with respect to each to expose contact locations (84,76) on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. Preferably, the chips are identical and rotated 180 DEG with respect to each other. Some of the leads of the lead frame for the double dense memory extend continuously under the stack to provide signal inputs through bit, address, control, power and ground inputs to the electronic devices (100'). These inputs are common between the adjacent chips. Wires are bonded from contact locations on each chip to common leads (102,104). If a lead is common and cannot be mixed with another common lead, for example, a control line, it is located at the center of the lead frame. Other leads are provided which are not common between the two chips, for example chip select lines. Wires are bonded between the contact locations on each chip and at least one of the common leads of the lead frame. <IMAGE> <IMAGE> |
