Thermal mismatch accommodated infrared detector hybrid array

摘要

A hybrid infrared focal plane array detector employs a detector layer and transparent substrate bonded to a thin semiconductor readout integrated circuit and thicker readout circuit substrate. The readout circuit is rigidly bonded to the readout substrate to form a composite structure having a thermal coefficient of expansion substantially matching that of the detector portion. The hybrid device may be cooled from room temperature to cryogenic operation temperatures without thermal mismatch structural problems.