发明名称 Circuit module having stacked circuit boards
摘要 A circuit module has a first circuit board, an IC chip mounted on the first circuit board, an electrode of the IC chip being connected to a wiring pattern of the first circuit board by a metal wire and the IC chip and the metal wire being coated with resin, and a second circuit board on which at least one unit of the first circuit board and the IC chip is mounted. The first circuit board is a double-side wired circuit board and the second circuit board is a single-side wired circuit board.
申请公布号 US5309326(A) 申请公布日期 1994.05.03
申请号 US19920983895 申请日期 1992.12.01
申请人 ROHM CO., LTD. 发明人 MINORU, HIRAI
分类号 H01L23/12;H01L23/498;H05K1/14;H05K3/28;H05K3/34;H05K3/36;(IPC1-7):H01R23/68 主分类号 H01L23/12
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