Method of using an improved solder to bridge a nonmetallic gap between metallic surfaces, said improved solder, and an improved solder connection to bridge a nonmetallic gap between metallic surfaces,申请号US08/006573-传众专利搜索

发明名称	Method of using an improved solder to bridge a nonmetallic gap between metallic surfaces, said improved solder, and an improved solder connection to bridge a nonmetallic gap between metallic surfaces
摘要
申请公布号	USH1306(H1)	申请公布日期	1994.05.03
申请号	US08/006573	申请日期	1993.01.21
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