Packaged semiconductor device assembly including two interconnected packaged semiconductor devices mounted on a common substrate

摘要

A semiconductor device includes a package substrate, a first IC package having external lead terminals which are downwardly bent with respect to a plane surface of the package and a second IC package having external lead terminals which are upwardly bent with respect to a plane surface of the package. These packages are disposed on one surface of the package substrate parallel to each other. One or more pairs of the external lead terminals of the first and second IC packages, which face each other and are electrically connected with to each other, are disposed on the same mount pads provided on the package substrate. Therefore, wires for connecting those lead terminals can be dispensed with and the other external lead terminals can be connected by simply drawing around wires without providing through holes. In addition, no positional deviation between the two packages, occurs and no solder bridges are created during soldering.