Surface shaping and finshing apparatus and method

摘要

A method and apparatus for selectively treating the surface of a substrate with a material. The method comprises supporting a workpiece at a work station and providing a source of fluent material for treating a preselected portion of a surface of the workpiece. A stream of the fluent material is directed toward the surface of the workpiece while effecting controllable relative movement between the stream of fluent material and the workpiece to impinge a select amount of the fluent material along a preselected path on the preselected portion of the surface of the workpiece. The fluent material is bonded with the preselected portion of the surface of the workpiece to produce a predetermined physical change on the preselected portion. The apparatus of the invention includes a mechanism to effect the specific steps of the novel method.