发明名称 Device for forming solder connections
摘要 PCT No. PCT/GB91/00130 Sec. 371 Date Sep. 18, 1992 Sec. 102(e) Date Sep. 18, 1992 PCT Filed Jan. 30, 1991 PCT Pub. No. WO91/11831 PCT Pub. Date Aug. 8, 1991.A device for forming a solder connection between a plurality of electrical conductors, comprises a hollow, dimensionally heat-recoverable sleeve 1 formed for example from polyvinylidine fluoride, the sleeve having one end that is open to allow the insertion of the electrical conductors therein, and another end that is closed by a substantially spherical sealing insert.
申请公布号 US5308924(A) 申请公布日期 1994.05.03
申请号 US19920917035 申请日期 1992.09.18
申请人 RAYCHEM SA 发明人 LAMOME, ALAIN
分类号 H01R4/02;H01R4/72;(IPC1-7):H01R4/22 主分类号 H01R4/02
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