| 摘要 |
This invention relates to a heat insulator and a structure using the heat insulator and aims to provide a heat insulator which can be subject to a dry application using the heat insulator in the molded board or a wet application, having characteristics similar to those of a conventional inorganic heat insulator and a high strength which has not been provided before and to provide a structure using the above heat insulator. The heat insulator of this invention is prepared by mixing 3 to 50 parts by weight of synthetic resin emulsion in solid content equivalency, 1 to 20 parts by weight of organic microballoon, 0.3 to 5 parts by weight of carbon fiber and 10 to 200 parts by weight of inorganic microballoon with 100 parts by weight of cement. And the heat insulator of this invention is prepared by mixing 3 to 50 parts by weight of synthetic resin emulsion in solid content equivalency, 1 to 20 parts by weight of organic microballoon and 0.3 to 5 parts by weight of carbon fiber with 100 parts by weight of cement.
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