| 摘要 |
A diode laser array made from a plurality of linear laser diode array assemblies affixed and in good thermal communication with bodies containing micro-heatpipes. Assemblies are stacked in a vertical manner to form two dimensional arrays. Each assembly is connected electrically and mechanically to adjacent assemblies to form the final assembly. In one embodiment the bodies are arranged in a vertical stairstep manner such that radiation from an upper assembly stimulates emission in adjacent lower assemblies thereby achieving frequency locking. In another embodiment said micro-heatpipe containing second bodies are fabricated from materials with a coefficient of thermal expansion closely matching with a coefficient of thermal expansion closely matching that of the laser diode array subassemblies. In another embodiment the assemblies form the evaporator of a second heatpipe device cooling means.
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