| 摘要 |
The present invention relates to a mullite ceramic multi-layered substrate (1), particularly that suitable for mounting small electronic parts such as LSI chips, etc., and has an object to provide a mullite ceramic multi-layered substrate (1) with a plating film layer (3) of high connection reliability on the surfaces of the substrate (1) and a process for producing the same, characterized in that a plating film layer (3) composed of Ni and B is formed on wiring conductors (2) for protection of the wiring conductors (2) or soldering connection of the electronic parts. With this structure, raising of the plating film (3) at the end parts and development of cracks on the surfaces of substrate (1) can be prevented. |
