发明名称 CUTTING METHOD FOR SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To allow judging pellet for acceptance or rejection while the pellet is being bonded on base by using electric conductive adhesive. CONSTITUTION:Powder of Fe, Al, Cu, Ni, etc. is mixed into conventional tar or rosin based thermoplastic resin in amount of 5-80%. If the mixed amount is less than 5%, electric conductivity is poor. If it exceeds 80%, adhesivity is reduced and cutting property by sandblast becomes poor. Using the adhesive allows pellet inspection which is bonded on base plate and therefore is convenient.</p>
申请公布号 JPS5583236(A) 申请公布日期 1980.06.23
申请号 JP19780156468 申请日期 1978.12.20
申请人 HITACHI LTD 发明人 SUZUKI KENSUKE
分类号 H01L21/301;H01L21/304;H01L21/78 主分类号 H01L21/301
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