| 摘要 |
PURPOSE:To make hygroscopicity better and to prevent the generation of dust by surrounding a semiconductor element from above putting a top lid on a base, and providing a hygroscopic region having a hygroscopic groove at a putting part for the top lid on the base. CONSTITUTION:A semiconductor element 10 is surrounded from above by putting a top lid 3 on a base 2. A sealing agent 41 is applied to a putting part 4 for the top lid 3 on the base 2, and the hollow space is made into a sealed state. In addition, a hygroscopic region S having a groove 5 is provided at the putting part 4 for the top lid 3 on the base 3. In this way, moisture trying to enter the hollow space from outside is held by providing the hygroscopic region S at the putting part 4, and it becomes possible to protect the semiconductor element 10 put in the hollow space from moisture. Accordingly, it becomes possible to provide a semiconductor device easily having better hygroscopicity and free the generation of dust. |
