| 摘要 |
PURPOSE:To provide the manufacturing method of semiconductor light emitting device, capable of improving productivity and reducing cost, by enlarging the area of a semiconductor substrate. CONSTITUTION:In the manufacturing method of a semiconductor light emitting device having a semiconductor chip 5, to which a heat sink material 7 is attached, the heat sink material 7 is bonded on a semiconductor substrate 2 after grinding a semiconductor substrate 1 and, subsequently, the semiconductor substrate 2 is divided to form the semiconductor chip 5. |
