| 摘要 |
PURPOSE:To make it possible to electrically connect the electrodes of a semiconductor device with an outer electric circuit surely, by soldering the outer leads firmly to a metallized layer on an insulating base made of aluminum nitride- based sintered or glass ceramic sintered material. CONSTITUTION:A semiconductor-device storing package comprises an insulating base 1 having a metallized layer 4 and a lid part 2. In the semiconductor-device storing package, a container has a space for storing a semiconductor device 3, and an external lead terminal 6 is mounted on the metallized layer 4 by a soldering material 7. The insulating base 1 is made of aluminum nitride-based sintered material or glass ceramic sintered material, and the soldering material 7 with a Vickers hardness of 40Hv or below is used when the external lead terminal 6 is bonded to the metallized layer 4. |
