发明名称 MANUFACTURE OF OPTICAL MODULE
摘要 PURPOSE:To obtain a manufacturing method of an optical module or the like for mounting an optical element or the like on a substrate which element requires high precision alignment. CONSTITUTION:In the manufacturing method of an optical module or the like wherein an optical element or the like is mounted and connected with a substrate by using solder bumps, base electrodes 7 for circular solder bumps 6 are formed on the facing surfaces of an element 1 and a substrate 3. The uppermost layer of the bump 6 is composed of Au or Cu. Either one of the facing electrodes is formed so as to be larger than the other electrode. The shape of the uppermost layer of the larger electrode is made nearly identical to the shape of the other facing electrode. The outer peripheral part except the facing part is covered in a belt type with a solder mask composed of material of low wettability of solder. Protrusions 4, 4 having specified shapes are formed at specified positions on the surface of the element 1 or the substrate 3, and the facing electrodes are aligned. The solder for the bumps 6 are heated and fused, thereby terminal-connecting the electrodes.
申请公布号 JPH06120225(A) 申请公布日期 1994.04.28
申请号 JP19920283549 申请日期 1992.09.30
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 TSUNETSUGU HIDEKI;HAYASHI TAKESHI;HOSOYA MASAKAZE;KATSURA KOSUKE
分类号 H01L21/60;H01L21/321;H01L23/12;H01L33/40;H01L33/62;H01S5/00 主分类号 H01L21/60
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