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发明名称
LAMINATED LC CHIP PART AND MANUFACTURE THEREOF
摘要
申请公布号
JPH06120076(A)
申请公布日期
1994.04.28
申请号
JP19920289440
申请日期
1992.10.02
申请人
TAIYO YUDEN CO LTD
发明人
HOSHI KENICHI
分类号
H01F27/00;H01F17/00;H01G4/40;H03H7/075;(IPC1-7):H01G4/40;H01F15/00
主分类号
H01F27/00
代理机构
代理人
主权项
地址
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