SOLID-STATE IMAGE SENSING DEVICE

摘要

PURPOSE:To miniaturize a light path system, reduce the optical axis adjusting operations of an optical filter and allow highly accurate operations. CONSTITUTION:A semiconductor chip 5 as a solid-state image sensing element and an optical filter 6 for covering the effective area of the semiconductor chip 5 are arranged. A gap control protruding pattern 7 formed of thin film resist is provided in the vicinity of the semiconductor chip 5 and an optical filter 6 is mounted on the protruding pattern 7. The gap control protruding pattern 7 can be previously provided on the semiconductor chip 5 or on the optical filter 6. Since the adhesive is applied on the protruding pattern 7, the adhesive is prevented from flowing into the picture element part and the bonding pad of the semiconductor chip 5. High mounting position accuracy and adhesive strength are allowed and optical axis adjusting operations are facilitated.