| 摘要 |
PURPOSE:To provide a method and an apparatus for forming leads easily and adequately without inflicting defective damage on a semiconductor device. CONSTITUTION:A lower die 4 of a lead forming dies is provided, while a heating jig 6 is put opposite to the lower die 4. The heating jig 6 having heaters 4a and 6a is applied to loads 2 of a semiconductor device so that the formed parts of the leads 2 are heated and softened by supplying heaters 4a and 6a with electricity. Then, the leads 2 are bent by pressing an upper die 5 downward so as to form terminal parts 2a at the ends of the leads 2. |
