| 摘要 |
PURPOSE:To reduce the time necessary for measuring the flatness of a photosensitive substrate and exposing a measurement mark image. CONSTITUTION:Data of flatness of each point of measurement regions 25A-25E on the shot region of a wafer 12 are obtained. In the measurement regions 25A-25E, while the focus position is changed and a wafer is shifted in the Y direction, measurement mark images 24A1,..., 24AN to 24E1,..., 24EN are exposed to light in order. The measurement results at the best focus positions in the respective measurement regions 25A to 25E are corrected by using the data of flatness, and the real values at the best focus positions are obtained. |
