| 摘要 |
<p>A device for making temporary or permanent electrical connections to circuit pads of an integrated circuit is made with conventional semiconductor fabrication processes. The device has a supporting substrate from which project a plurality of insertion structures (10) that are in mating alignment with corresponding circuit pads (30) of the integrated circuit. Each insertion structure is metallized to make electrical contact with the corresponding circuit pad. The electrical contacts may be temporary or permanent depending upon the choice of metallization and the pressure applied to the contacting surfaces. The insertion structure devices have particular application for functional testing, electrical burn-in and packaging of an integrated circuit either as a full wafer or as an individuel die.</p> |
