| 发明名称 |
METAL POWDER COMPOSITION FOR METALLIZATION AND METALLIZED SUBSTRATE |
| 摘要 |
A metal powder composition for metallization, which is used for forming a metallized coating from a paste comprising copper and titanium powder and is composed of 95-99.5 % of copper and 0.5-5 % of titanium by weight. A metallized substrate is obtained by coating a substrate with the paste and baking the resultant substrate. |
| 申请公布号 |
WO9409182(A1) |
申请公布日期 |
1994.04.28 |
| 申请号 |
WO1993JP00781 |
申请日期 |
1993.06.11 |
| 申请人 |
TOKIN CORPORATION |
发明人 |
WATABE, YOUHEI;IWATA, SHINICHI;OHNO, TOMEJI |
| 分类号 |
C04B41/51;C04B41/52;C04B41/88;C04B41/89;C22C1/04;C23C24/08;H01L21/48;H05K1/09;H05K3/38;(IPC1-7):C23C24/08;B22F1/00;C22C9/00 |
主分类号 |
C04B41/51 |
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