发明名称 MULTILAYER PRINTED WIRING BOARD AND PRODUCTION THEREOF
摘要 <p>PURPOSE:To obtain a multilayer printed wiring board mounting a capacitor effective for downsizing of electronic circuit in which the capacitor is integrated with high positional accuracy with no influence on the capacitance thereof. CONSTITUTION:After circuit patterns 2, 2a, 2b are formed on a nonwoven glass board 1 impregnated with epoxy resin, a dielectric laminate 4 is inserted into an upwardly tapered hole 3 made in the inner face at a size corresponding to the external dimension of the dielectric laminate 4. An electrode part 5 is then formed of a metallize paste to be conducted with the circuit patterns 2a, 2b and then it is sandwiched through epoxy resin adhesive sheets 6 by printed wiring boards 9a, 9b for outer layer and hot-pressed. Since the printed wiring boards 9a, 9b are conducted through the conductor part 7 of a through hole 8, the dielectric laminate 4 does not fall off, positional accuracy is enhanced, and thermal influence on the dielectric laminate 4 is suppressed as compared with a case where an unfired ceramic board is employed and highly accurate capacitance can be sustained.</p>
申请公布号 JPH06120673(A) 申请公布日期 1994.04.28
申请号 JP19920267726 申请日期 1992.10.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TOKIWA TAKESHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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