| 摘要 |
PURPOSE:To increase the current capacity of a coil for compact magnetic induction element such as transformer, inductor, etc., in combination with an integrated circuit device. CONSTITUTION:This coil 30 is composed by a method wherein trench 31 deeply formed from the rear surface side of a semiconductor substrate 11 of a chip 10 on whose surface side another semiconductor device 20 such as integrated circuit device, etc., is formed is covered with an insulating film 32 so as to fill up the trench 31 with a high conductive metal such as copper, etc., as a coil conductor 33 by non-dielectrolytic plating step etc. Furthermore, even if the arrayal pitch of the coil conductor 33 is made minute for miniaturization of the magnetic induction element, the trench 31 can be formed deeper if necessary to increase the level of the coil conductor 22 while effectively using the conventionally idling space on the rear surface side of the substrate 11 thereby enabling the current capacity of the coil to be increased. |
