| 摘要 |
PURPOSE:To detect a soldering defect by observing the soldering state in the periphery of a lead within a through-hole by the image processing technique. CONSTITUTION:A solder 10 in the periphery of a lead 8 within a through-hole 9 is illuminated by the omnidirectional radiation. A soldered face is photographed immediately above a soldered part. The photographed data is processed and binarized, and the area of a dark part is calculated from the counted number of dark pixels. A soldering defect of a blow hole 12 is detected by comparing the area of the dark part with a reference area. |
