| 摘要 |
<p>PURPOSE:To facilitate the manufacture of a board by putting it in such structure that a power element can be mounted without counterboring it, in a metallic base multilayer printed wiring board. CONSTITUTION:Metallic wiring 110 is junctioned onto a metallic base 101 through an insulating layer 103, and a multilayer printed wiring board 102 is junctioned onto the insulating layer 103 through an adhesive 114. Moreover, an upper wiring 104 and a lower wiring 106 are junctioned to both sides of the insulating layer 105 being epoxy resin, and the board 102 has a through hole 107 and a through hole 109. Copper films 108 are formed on these sidewalls by plating, and the upper wiring layer 104 and the lower wiring layer 106 are conductive by the copper film 108. On the insulating layer 103 on the metallic base 101, a copper metallic wiring 110 is arranged in the position where a power element 120 is arranged, and the power element 120 is junctioned with this metallic wiring 110 by solder 111. The metallic wiring 110 is electrically junctioned with the lower wiring layer 106a in the vicinity of its arrangement by solder 111.</p> |
