PRODUCTION OF LAMINATE FOR MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To make the adhesive layer thin between compositional materials in a laminate for multilayer printed wiring board. CONSTITUTION:A thermosetting adhesive resin film having low softening temperature containing no continuous fibrous basic material is arranged on the inner layer circuit board side whereas a thermosetting adhesive resin film having high softening temperature containing continuous fibrous basic material is arranged on the outer layer material side and then the inner layer circuit board and the outer layer material are bonded to produce a multilayer structure. It is then heated at a temperature for fusing the thermosetting adhesive resin film having low softening temperature in order to fill the recesses in the inner layer circuit and then the temperature is raised to cure the thermosetting adhesive resin film having high softening temperature.