| 摘要 |
PURPOSE:To prevent the temperature characteristics of a semiconductor pressure sensor from being exerted an effect even if the coating amount of a bonding agent is varied and to contrive to improve the linearity of the sensor as a stress concentration to the adhesion part of a semiconductor chip is relaxed. CONSTITUTION:A semiconductor pressure sensor is one formed in such a way that a semiconductor chip 10 is bonded and fixed in a package 12 with a bonding agent 20 consisting of a silicon gel. In the case where the sensor is used, even if the silicon gel of the bonding agent 20 is squeezed out (a squeezed out bonding agent 20b) from an adhesion part 20a and creeps on the rear of a diaphragm 10a, the temperature characteristics of the sensor are mever affected because the silicon gel itself is very soft. Moreover, because of the softness of the silicon gel, as stress concentration to the adhesion part 20a of the sempiconductor chip is relaxed, the linearity of the sensor is not deteriorated and is inversely improved.
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