METHOD FOR COOLING LSI AND ELECTRONIC CIRCUIT PACKAGING,申请号JP19920267475-传众专利搜索

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发明名称	METHOD FOR COOLING LSI AND ELECTRONIC CIRCUIT PACKAGING
摘要
申请公布号	JPH06120386(A)	申请公布日期	1994.04.28
申请号	JP19920267475	申请日期	1992.10.06
申请人	HITACHI LTD	发明人	SHINDO TAKANORI
分类号	H01L23/467;H05K7/20;(IPC1-7):H01L23/467	主分类号	H01L23/467
代理机构		代理人
主权项
地址

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