| 摘要 |
<p>PURPOSE:To obtain a semiconductor device enabling prevention of occurrence of a crack or peeling of a semiconductor element and a passive component and improvement of reliability thereof, by relaxing a stress acting on a lead frame when a tie bar part of the lead frame is cut. CONSTITUTION:A lead frame 1 is so formed that its inner leads 1b are thicker than outer leads 1c. A transistor element 2 and a semiconductor element 3 are die-bonded on a transistor element mounting part 1a and the inner lead 1b of the lead frame 1 respectively and wire-bonded to desired inner leads 1b by gold wires 7. A chip resistor 4 is connected between desired inner leads 1b with solder 6. Molding is made with sealing resin in this state and thereafter a tie bar part 5 is cut.</p> |
