发明名称 MANUFACTURE OF LAMINATED BOARD
摘要 PURPOSE:To manufacture copper-clad laminated board in a short time and at a low cost by arranging patterns on a ceramic substrate in high accuracy. CONSTITUTION:By subjecting a conductive member to etching process or pressing process, a frame 23 and predetermined patterns 22 formed in the frame 23 and supported by that are formed into one body. After that, the predetermined patterns 22 are bonded to one main plane of a board 21 by heating, using the frame 23 as a guide. Further after that, the frame 23 is but off.
申请公布号 JPH06120370(A) 申请公布日期 1994.04.28
申请号 JP19920270174 申请日期 1992.10.08
申请人 TOSHIBA CORP 发明人 ARAKI KOJI
分类号 H01L23/12;H01L23/495;H05K3/20;(IPC1-7):H01L23/12 主分类号 H01L23/12
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