| 摘要 |
PURPOSE:To enhance reliability by eliminating effect of external electromagnetic noise. CONSTITUTION:Integrally formed metal film 13 and dielectric film 12 covers the entire surface of a semiconductor chip 1, bonding wires 5, and the die pad part 3 of a lead frame 2, and a part of the surface of the lead part 4 of the lead frame 2. When the metal film 13 is connected with ground potential, circuit part in a semiconductor chip 1 and the bonding wires 5 are shielded completely thus enhancing electromagnetic shield effect of the metal film 13. Consequently, influence of external electromagnetic wave on the circuit part in the semiconductor chip 1 or on the bonding wires 5 can be suppressed as compared with a conventional semiconductor device. Electromagnetic noise radiated from the bonding wire 5 is also reduced and electromagnetic interference between the bonding wires 5 can be suppressed. |
