| 摘要 |
<p>PURPOSE:To obtain a chip part which can be electrically connected well when it is mounted by a method wherein a chip part is prevented from moving or rising due to the thermal shrinkage of solder at solidification. CONSTITUTION:A chip part 6 is equipped with a chip main body 4 and electrodes 5 provided to the end faces of the chip main body 4, and the electrode 5 is formed smaller than the section of the chip main body 4 in parallel with the electrode 5. The electrode 5 is provided making its lower side flush with the underside of the chip main body 4. Therefore, a stress caused by the thermal shrinkage of solder 7 at solidification can be lessened, so that the chip part 6 can be prevented from moving or rising, and consequently the chip part 6 improved in electrical connection can be realized.</p> |
