| 摘要 |
PURPOSE:To produce a low permittivity printed board, commonly employed in the circuitry of various electronic appliance, in which reliability is enhanced in bonding and deterioration of dielectric performance due to flow-out of adhesive to parts other than bonding part is prevented. CONSTITUTION:A signal pattern 2 and a connecting land 3 higher than the signal pattern 2 are formed on the surface of an inner layer board 1 and then the top surface of the connecting land 3 is coated with a microcapsule type conductive adhesive 15 produced by covering the surface of highly conductive fine metal particles with thermosetting and thermoplastic insulating resin. The connecting lands 3 are then hot-pressed while opposing each other to conduct the conductive adhesive 15 electrically between the connecting lands 3. The adhesive 15 is then cured and the boards 1 are laminated and residual adhesive 15 is washed away from the surface of the inner layer board 1. |
