Resin-sealed type semiconductor device and method for manufacturing the same.

摘要

A resin-sealed type semiconductor device comprises a lead frame (10) having a bed (11) and external leads (12), a semiconductor element (20) mounted on the bed (11) and having electrodes (21), a fine metal wire (30) for making an electrical connection between the electrode and the lead frame, a resin layer (40) which seals the semiconductor element, fine metal wire and portion of the lead frame therein and a recess (41) formed at a central portion of one surface side of the resin layer and having a controlled depth, whereby the development of cracks in the resin layer as caused by heat load is prevented.