| 摘要 |
The object of the description is a flexible throughput of a two-sided printed board (1), by which ruptures and electric breaks caused by the different thermal expansion properties of the materials in known throughputs are avoided, and which nevertheless allows the use of an inexpensive printed board material and of the wave soldering method. According to the invention, two holes are made into the printed board, into one of which a metal sleeve (4) is inserted. The sleeve is surrounded by a conductor foil (2), i.e. soldering fringe on the upper surface of the printed board. The second hole (5) is without a sleeve and comprises a conductor foil, i.e. soldering fringe on the lower surface of the printed board. The overshoot wire (6) is composed on the printed board so that its one arm (6a) is placed into the sleeve (4) and its other arm (6b) extends through the hole (5) below the printed board. In wave soldering, the lower surface of the printed board (1) touches the molten solder, which rises from the sleeve (4) and fixes this by soldering to the overshoot wire (6) and the upper foil (2) and simultaneously the second arm (6b) of the wire (6) is soldered to the lower conductor foil (3). |
